Photo by Laura Ockel on Unsplash Chiplet is undoubtedly the most suitable semiconductor design and manufacturing solution to scale complex chips reaching the reticle limit. Several silicon products have already adopted chiplet, mainly processors. These products have showcased that using multiple chiplet can significantly improve performance. All while not worrying

Photo by Maxence Pira on Unsplash The semiconductor industry continually faces challenges as it shrinks transistor sizes to increase performance. One promising solution to achieve this goal is the use of chiplets. Chiplet is small; independent silicon dies that can be interconnected to create a larger, more powerful chip –

Photo by Luan Gjokaj on Unsplash Semiconductor products are struggling to meet the demand to balance power, performance, and area requirements. The challenge to enable efficiency is increasing while there is also a need to meet new technological requirements without adding bottlenecks. Such challenges are slowly becoming impossible tasks whereby

Photo by Louis Reed on Unsplash Chiplets are changing the way complex products like XPUs getting designed and manufactured. Its impact is how modular the new XPU solutions are becoming. This modularity is paving the way for new-age IP-driven XPU design and manufacturing and opening up features that were not