Published On: July 17, 2022

Photo by Vishnu Mohanan on Unsplash Several semiconductor industry-wide roadmaps are planned and released by semiconductor companies and also different technical semiconductor groups. These semiconductor roadmaps are vital in providing glimpses of future semiconductor technologies and how they will shape silicon products. Out of all the semiconductor roadmaps, the two most critical are the die roadmap and the package roadmap. These two roadmaps are drafted by separate technological groups apart from different roadmaps from semiconductor companies. There is no question that these roadmaps provide a way to design and manufacture next-gen silicon products to transform industries relying on semiconductors. Package: Roadmap at package-level focus on providing next-gen integration solutions. Die: Die level roadmap focuses purely on the devices to enable next-gen nodes. However, today, the semiconductor industry is at the cross-section where […]