The Growing Influence Of Semiconductor Package On Scaling
Photo by Christopher Bill on Unsplash Advancements in package technology are as vital as advancements in technology nodes. These two semiconductor solutions enable silicon products to work per the required specifications. Technology node innovation has occurred more rapidly than package technology. Given that now the technology node is going to hit the node wall, it is time for package technology to provide avenues to shape the future of next-gen silicon design and manufacturing. The semiconductor package has always been an integral part of semiconductor manufacturing. It has shaped and powered different silicon features and cost-optimized solutions for several decades. Semiconductor package technologies also ensure that the end-product can withstand harsh operating conditions by managing different thermal, chemical, physical and mechanical characteristics. Features: Package level scaling creates silicon area for new […]
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