Published On: March 20, 2022

Photo by L N on Unsplash Semiconductor products often fail, and finding the root cause thus becomes a critical process. More so, when the product is already in production. Failure and root cause analysis are vital steps towards finding issues with the semiconductor product. Doing so requires an inspection process that allows engineers to look inside the chip. Several advanced equipment and technologies (SEM and beyond) can provide an in-depth view of what is happening inside the chip. The hurdles thus are not the availability of technology required to drive failure analysis. The real challenge is the complexity (silicon level) that the advanced design and manufacturing brings to enable failure analysis. Complexity: Growing transistor count increases the die level complexity, which brings difficulties to perform failure analysis without investing more than […]