Published On: February 28, 2021

Photo by Ryan on Unsplash THE MOVE TOWARDS THE NEXT-GEN SEMICONDUCTOR PACKAGE TECHNOLOGY Packaging plays an important role in almost all the industry. From cars to rovers, packaging the product before shipping is vital. Doing so cost-effectively is critical to ensure the product cost is not affected. The same story is valid for the semiconductor industry, where the packaging technology ensures that the silicon die is protected from harsh mechanical to environmental conditions. In a nutshell, package technology in the semiconductor industry is geared towards providing the following features to the die area: Thermal: Ensure the heat is dissipated efficiently out of the die to avoid thermal runaway. Mechanical: To save silicon from any outside impact like vibration or stress. Connectivity: Enable a pathway for connecting the die to another system via a […]