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Published On: January 2021

The Challenges Ahead For The Heterogeneous Integration

Leave a Comment / BLOG, HETEROGENEOUS, MANUFACTURING, SEMICONDUCTOR, TECHNOLOGY /

Photo by Florian Olivo on Unsplash THE GROWTH OF HETEROGENEOUS INTEGRATION The computer architecture design to cater the personal computing to data center needs has seen many changes over the last four decades. Computer architects have pushed the boundaries of designing novel ways to process data, which has lead to the manufacturing of advanced processing units (XPU) that are powering low to high-performance computing systems. The growth of XPU is not only driven by the novel designs but also due to the shrinking transistor size. The advanced technology-node has allowed computer architects to take advantage of billions of transistors in the smaller area possible. With the ability to pack more transistors, the processing speed has increased, which has reduced the time taken to process user requests. All these hardware features […]

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The Semiconductor Wafer Virtualization

Leave a Comment / BLOG, MANUFACTURING, SEMICONDUCTOR, TECHNOLOGY, VIRTUALIZATION /

Photo by Adi Goldstein on Unsplash THE NEED FOR WAFER VIRTUALIZATION The use of virtualization techniques in the software and the hardware industry has enabled several technology developments. Virtualization provides developers the infrastructure to develop, test and deploy solutions catering both to the consumers and enterprises. The three major types of virtualization occur at the application, operating system, and architecture levels: Application: At the application level, virtualization provides a way to run an application inside a guest operating system that runs on top of a host operating system. It requires large memory and high-speed processors to ensure the memory level translation are fast enough to minimize latency when using the application inside a guest operating system. Operating System: The operating system virtualization allows the developers to create containers to minimize (and almost eliminate) application dependencies when

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The FAB-LITE Semiconductor Fabrication Model

Leave a Comment / BLOG, BUSINESS, MANUFACTURING, SEMICONDUCTOR, TECHNOLOGY /

Photo by Laura Ockel on Unsplash THE CHANGING SEMICONDUCTOR BUSINESS MODEL The semiconductor product development requires many businesses (from materials to logistics) to work in harmony. The complex process of fabricating semiconductor devices has also given rise to the cost of development. To lower the expenditure and to survive the semiconductor business, companies have leveraged different business models. The three types of semiconductor business model that define the design and the fabrication houses have been in use for several decades: Pure-Play FAB: In Pure-Play FAB (fabrication) model, the semiconductor companies invest only in semiconductor fabrication plants to turn the design into silicon products. These Pure-Play FABs in the last few years have also started investing in OSATs to leverage the growing assembly and testing demand. Examples: TSMC and GlobalFoundries. FAB-LESS: FAB-LESS

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